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August 04, 2006
TI Introduces UHF Gen 2 Silicon
Following the success of Impinj in manufacturing and demonstrating the efficiency of UHF Gen 2 tags at the item-level, Texas Instruments (TI) has chosen to go the same way. The world’s largest integrated manufacturer of RFID transponders and reader systems has built its Gen 2 silicon on an advanced analog process node at 130 nanometers.
The silicon chips, which come with built-in Schottky diodes that allow efficient conversion of RF signal energy, are available in wafer and strap form factors. The chips can be written to under typical harsh conditions like low RF power and high background electromagnetic interference (EMI) that are prevalent in supply chain factories and warehouses. Users have the option of developing tags and labels that optimize TI’s Gen 2 silicon. Texas Instruments reports:
Offering greater design flexibility to customers, TI is providing its Gen 2 silicon to inlay, label and packaging manufacturers in three convenient forms: bare wafers to support various assembly processes; processed wafers (bumped, sawn with back grind) that are suitable for immediate use with commercially available inlay equipment; and silicon chip on straps for label and packaging manufacturers who are printing their own antennas.
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